Thin-film silicon technology and devices

Precision-engineered thin-film silicon for high-performance devices.

Engineer in cleanroom holding a thin, flexible, and adhesive photovoltaic (PV) foil
© CSEM - Thin, flexible, and adhesive photovoltaic foil.

Thin-film silicon technology is a versatile and efficient solution for various applications, including electronics, solar panels, biomedical devices, and more. At CSEM, we leverage our extensive expertise and state-of-the-art facilities to develop high-performance thin-film silicon devices tailored to meet the specific needs of our clients.

Thin-film silicon solar cells

Thin-film silicon solar cells can be produced on a wide variety of substrates, such as glass, metal surfaces, plastics, and even paper. This flexibility allows for aesthetic integration into numerous products.

  • The cells’ features include very thin layers and an excellent spectral response to visible wavelengths. This results in superior performance for small devices under low light and indoor illumination conditions.
  • Power conversion efficiencies range from 4% to 20%, depending on the substrate, spectral conditions, and light intensity. The lower end of this range corresponds to devices on flexible substrates under outdoor illumination conditions, whereas the higher end of this range corresponds to small-scale devices under blue-rich indoor illumination conditions.
  • Thin layers with thicknesses between several nanometers and several microns can easily be fabricated in our lab at low temperatures (~80°C–250°C) for compatibility with a wide range of substrates and materials.
  • CSEM has a wide variety of manufacturing equipment and characterization tools to fabricate and develop customized solutions for many different applications and products.

So far, CSEM’s thin-film silicon solar cells have been integrated into the Tissot T-Touch Solar Connect watch, which is available on the market, as well as in demonstrators for IoT, wearables, and space applications.

Applications for thin-film silicon technology

State-of-the-art manufacturing and characterization techniques for thin-film silicon

Device characterization

We perform dark and illuminated I-V measurements under carefully controlled conditions, including spectrum, intensity, and temperature. Additionally, we can conduct external quantum efficiency measurements and capacitance-voltage measurements to ensure precise and reliable data.

Film characterization (optical, electrical and structural)

Our film characterization capabilities include a variety of optical, electrical, and structural analysis tools. These include spectroscopic ellipsometry, reflection-transmission measurements, Raman spectroscopy, FTIR, current-voltage, capacitance-voltage, and 4-point probe measurements. We also utilize X-ray diffraction analysis and a wide range of microscopy techniques, such as confocal microscopy, SEM, and TEM.

Laser patterning

Our picosecond laser enables selective layer removal and patterning, achieving feature sizes down to 20 μm. This precision allows for the creation of intricate and detailed patterns on various layers.

Thin-film deposition

  • We use Plasma Enhanced Chemical Vapor Deposition (PECVD) to deposit amorphous and microcrystalline silicon-based thin films. Both intrinsic and doped (n-type and p-type) layers can be fabricated.
  • Alloyed materials such as silicon carbide, silicon oxide, silicon nitride, and silicon germanium can also be studied and fabricated to precisely tune bandgap and refractive index, and for a wide range of color applications.
  • Physical vapor deposition techniques such as sputtering (dc and rf) and evaporation are also widely available to deposit a vast range of metal and metal-oxide layers. These can be used as transparent or opaque contact films.

Reactive ion etching

We utilize Reactive Ion Etching (RIE) with SF6-based plasma chemistry to entirely remove silicon layers and their alloys from surfaces. By employing shadow masks and sacrificial layers, we can achieve selective pattern etching

Partner with us for cutting-edge thin-film silicon solutions

At CSEM, our customer-centric approach ensures that we develop innovative solutions tailored to your needs. With over 40 years of expertise in thin-film technology, a proven track record in successful technology transfers, and state-of-the-art facilities, we are dedicated to helping you achieve your goals.

Contact us today to learn how our advanced thin-film silicon technology can enhance your products and drive your success.

Innovation and success in thin-film silicon technology

Where thin-film silicon meets wearables, space, and science.