November 12, 2020


Organs-on-chips, implantable devices, continuous monitoring – nearly 70 institutions from Europe are taking part in Moore4Medical, a joint ECSEL project to step-up the development of tomorrow’s electronic medical devices. CSEM is leading the Swiss consortium.

Surgeons and patient

In response to calls for new healthcare solutions, several promising bioelectronic technologies and applications are emerging. Among others, these include a new generation of active implantable devices, organs-on-chips (OOCs), and remote patient monitoring sensors. Their aim is to reduce hospitalizations, expand the use of personalized therapies, and further develop intelligent point of care diagnostic tools. However, bridging the gap between promising MedTech ideas and developing them into real-world applications remains a challenge in the industry.

To accelerate innovation efforts and close this gap, the Moore4Medical project will develop multi-user open technology platforms for use in a variety of emerging medical domains. Philips Research, in conjunction with Philips Innovation Services, has brought together 66 selected companies, universities, and institutes from 12 different countries. Their mission is to ensure that promising bioelectronic technologies created through the project are both competitive and appealing to the European marketplace. CSEM is leading the Swiss consortium of partners, which includes Dyconex AGInpher SàrlInSphero AG, and 3dbAccess AG. The project has a budget of 75M€ thanks to funding provided by Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking in collaboration with the European Union's H2020 Framework, National Authorities including Innosuisse, and partner contributions. The project, launched in Summer 2020, is evolving well despite the COVID-19 situation thanks to the organization of multiple virtual meetings between partners. 


Personalized medicine and reduced reliance on animal models

CSEM’s researchers will work on two parts of the project. The first area concerns OOC technology: a type of artificial organ (organoid) grown on an electronic chip that can be used in pharmaceutical testing. This technology reduces the need for animal trials while also providing a personalized medical approach. “It particularly benefits women, for whom certain treatments – primarily designed with men in mind – do not always match their biological specificities,” says Technology Coordinator Erika Györvary, Swiss country coordinator of Moore4Medical. Engineers at CSEM are developing smart lids to match multi-well plate platforms, like those produced by InSphero AG, to continuously assess the condition of artificial tissues grown on the plates.

The project also focuses on remote, secure, round-the-clock, post-hospital monitoring of patient’s vital signs. Several wearable sensors have been designed by members of the Moore4Medical consortium to help prevent systematic hospitalizations. These sensors can track a wearer’s physical/psychological health in the home environment and transmit this data to offsite medical professionals. CSEM, alongside Inpher Sàrl & 3db Access AG, is working on an innovative platform that will ensure end-to-end confidentiality and integrity of sensitive patient data along the entire data flow. The platform will go beyond available state-of-the-art security systems, using advanced technologies to give patients direct control over their data. It will provide secure data processing and be capable of deterring sophisticated attacks.

Dyconex AG will provide interconnect and encapsulation solutions for implantable devices developed as part of the project.

Moore4Medical aims to develop electronic systems in six areas of medicine: implants, organs-on-chips, drug adherence monitoring, smart ultrasound, radiation-free interventions, and the remote tracking of vital signs.

List of Swiss partnersDyconex AGInpher SàrlInSphero AG, and 3dbAccess AG and CSEM.

The Moore4Medical project has received funding from the Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking in collaboration with the European Union’s Horizon 2020 research and innovation program under the Grant Agreement nº H2020-ECSEL-2019-IA-876190.