Thin-Film Lithium Niobate Foundry Services by CSEM

CSEM supports the photonic community with various services based on its standardized TFLN PIC platform, dependable process design kit (PDK) and a 150 mm wafer-scale fabrication process, which includes PIC design, manufacturing, and testing.

Photonic Integrated Circuits (PICs) manufactured in 150 mm wafer-scale process.© CSEM

CSEM is at the forefront of introducing an open-access foundry service for standardized TFLN PICs (Thin-Film Lithium Niobate on Insulator Photonic Integrated Circuits), designed specifically for prototyping, and research and development. The distinctive features of this service include a unique combination of three device layers, two metallization steps, cladding, back-end-of-line opening steps, and seamless chip facets integrated into a monolithic PIC platform.

This integration opens up a myriad of possibilities for intricate PIC designs, as well as hybrid and heterogeneous integration. Moreover, it facilitates easy electrical and packaging interfacing.

Our state-of-the-art technology and expertise in the PIC domain ensure superior quality and performance for applications in telecommunications, data centers, quantum, and beyond. Partner with CSEM to leverage the potential of TFLN in your innovative projects.

Process Design Kit (PDK) C-band building blocks

Process design kit for TFLN PICs

CSEM TFLN PIC foundry services is supported by a dependable process design kit (PDK) at telecommunication C-band. The PDK encompasses a set of active and passive building blocks, technology layers and design guide documentation.

Furthermore CSEM provides the PIC designer with parametric cells (PCell) for the building blocks which enables the designer to turn the standardized components to customized ones (in compliance with the fabrication design rules), easing the layouting and circuity of the customized PICs.

Multiple 5x5 mm² chips fabricated on CSEM's TFLN PIC platform.

Why work with us

  • MPW and custom RUNs (3-4 RUNs / year)
  • Extensive library of standardized building blocks
  • Expert check and consultation
  • Design rule check (DRC)
  • Design, simulation, layout, and characterization services
  • ISO9001-certified 150 mm wafer foundry
  • Independent and innovative foundry located in the heart of Europe
  • High level of confidentiality 
      

Current offerings for thin-film lithium niobate PICs

CSEM's TFLN PIC foundry service covers the need in design, manufacturing, and testing.

MPW RUNs

Technology features
Full stack: TFLN-Active-3WG2MET
2 RUNs per year
Fast: TFLN-Active-2WG1MET
2 RUNs per year

Deliverables
8 copies per design
DRC report
Inspection pack
Options: custom chip size from 5x5 mm² up to 10x30 mm²

Order criteria
Minimum order 100 mm²

Dedicated RUNs

Technology features
Customized stack: from 1 WG to a full stack
Flexible starting date
Fast delivery in case of reduced technology node

Deliverables
Minimum 100 (5x5 mm²) chips per wafer
DRC report
Inspection pack
Options: customized chip size and shape / flexible design rules

Order criteria
Minimum order of equivalent to 400 (5x5 mm²) chips

Design service

Technology features
Passives and actives BBs
From visible to IR

Deliverables
EME, FDTD, FEM
Layout, DRC, final GDS file
Options: design consultation / design report

Order criteria
Order minimum 1 month before the design submission deadline

Testing

Technology features
Passives and actives BBs
Telecom C-Band, 780 nm band

Deliverables
Automated setup, dedicated lab
Options: insertion loss, EO bandwidth, statistic / characterization report

Order criteria
Limited offer depending on the available resources

Demo chips

Technology features
Full stack
Only passive
Only active
Only metals

Deliverables
Chips with only one type BB
PDK chips with only passive BBs
PDK chips with only active BBs
Options: trial evaluation of the platform / practice electrical and optical interfacing / practice packaging and reliability tests

Order criteria
Minimum order of 1 chip
Pricing based on the availability and the stack complexity

Schedule of the MPW RUNs

We support a robust MPW life cycle by assisting photonic designers at every stage of mask preparation. This includes systematic DRC during design submission and functional-level consulting, as well as advice to optimize PIC designs.

Full stack MPW

CSEM’s TFLN PIC full-stack MPW RUNs calendar.

Fast MPW

CSEM’s TFLN PIC fast MPW RUNs calendar.

Take the next step in your photonics journey

Reach out to us for a consultation and discover how we can tailor solutions to meet your specific needs.

Check out our flagship EU projects!

ELENA European Project - the logo

ELENA is a Photonic Integrated Circuits (PICs) platform based on lithium niobate on insulator (LNOI). This novel PIC platform will be available to all interested parties as an open foundry service.

Lolipop EU Project

LOLIPOP is a photonic integration project that combines silicon nitride with LNOI technology—an innovative Lithium Niobate Empowered Silicon Nitride platform designed for fragmentation-free operation in the visible and near-infrared (NIR) spectra..

PATTERN European Project - the logo

PATTERN aims to create a groundbreaking Photonics Integrated Circuit platform with the world's first 100+ GHz microwave photonics PDK & ADK. It involves co-integrating BiCMOS drivers, light sources, detectors, optical isolators, and acousto-optic modulators for advanced hybrid integration in photonic circuits.

SPRINTER European Project - the logo

SPRINTER is an innovative project striving to advance research and development in the realm of photonics—low-cost and energy-efficient hybrid PICs for fiber-optic, free-space optical, and mm-wave communication systems supporting time-critical networking in industrial environments.

 

uTP4Q European Project - the logo

uTP4Q will employ micro-transfer printing as the key technological framework for combining multiple functional technologies for quantum optical processing on a Silicon Nitride waveguide interposer.

CLUSTEC European Project - the logo

CLUSTEC is a project in the expansive realm of quantum technologies, specifically focusing on scalable quantum technologies with continuous variables. It aims to unlock the full potential of continuous-variable (CV) cluster-state technology by achieving both conceptual and technical breakthroughs.

Meet our happy customers

Logo MIT

Mikkel Heuck

Chercheur scientifique laboratoire de photonique quantique

Nous soutenons fortement la démarche du CSEM visant à construire un service de fonderie pour cristaux photoniques en niobate de lithium, car nous croyons que cela aura un impact majeur sur l’industrie et sur la communauté scientifique. Nous avons une chance incroyable d’avoir été associés très tôt à cette démarche et de travailler avec le CSEM, dans la mesure où ses capacités étendent et accélèrent notre recherche dans le domaine de la photonique quantique intégrée.

Logo Eblana Photonics

Richard Phelan

Responsable conception laser

Plusieurs projets réalisés avec le CSEM nous ont permis d’effectuer des avancées substantielles dans les lasers à semi-conducteurs et nous ont ouvert de nouvelles opportunités commerciales dans les lasers à raie ultrafine pour les applications LIDAR. Les discussions avec les experts du CSEM nous ont apporté de nombreuses idées nouvelles et des retours utiles pour différentes applications telles que la métrologie et la détection.

Logo Brolis Sensor Technology

Augustinas Vizbaras

Directeur technique

Le CSEM possède une connaissance et une maîtrise incroyables des systèmes optiques permettant de mesurer les signes vitaux. Il a utilisé ce savoir-faire pour nous aider à atteindre notre objectif, nous permettant ainsi d’améliorer considérablement le logiciel OptiBP et, par conséquent, la gestion de l’hypertension à l’échelle mondiale.