Reliability assessment services

We carry out environmental and mechanical reliability tests according to the standards, such as MIL, Telcordia, JEDEC, AEC, ESCC, IEC, etc.

We also elaborate custom test procedures for reliability testing of any devices and components based on the intended use-case scenario and conditions.

We develop and construct custom electrical test benches of any complexity for the lifetime evaluation of electrical devices and components. These measurements can also be carried out in-situ during the environmental and mechanical tests. Reliability testing can also be conducted according to custom standards and requirements upon request.

We perform standard and thermomechanical fatigue testing, including cycling under temperature and load with specialization on additively manufactured parts

Our characterization facilities allow us to conduct failure analysis to close the loop on the reliability investigation.

Access a full suite of custom and standard testing solutions to assess the reliability of components designed for demanding applications, including miniaturized electronics and systems exposed to harsh environments such as space, automotive, and industrial settings, and additively manufactured (AM) parts.

Environmental and mechanical stress testing

• Wafer-level and packaged electronic components and assemblies, MEMS, PCBs, electrical connectors.
• Compliant with standards such as MIL, Telcordia, AEC, JEDEC, etc.
• Humidity and corrosion testing: humidity ranges from 30 to 95% RH.
• Highly Accelerated Stress Test (HAST): temperature up to +162°C, humidity up to 100% RH.
• Temperature shock and temperature cycling: temperatures from -65°C to 200°C.
• High- and low-temperature operation life tests (HTOL/LTOL).
• Mechanical vibration (random and sine sweep): accelerations up to 90 g, frequencies up to 6300 Hz.
• Mechanical shock: accelerations from 5 g to 5000 g, high-speed video recording.
• In-situ electrical measurements during environmental and mechanical tests.

Custom testing capabilities

We engineer custom test solutions for specialized applications or novel technologies. This includes the design and implementation of dedicated setups with integrated control software and graphical interfaces such as:

• Custom electrical characterization test benches
• High-speed camera systems for dynamic mechanical or fatigue analysis

These flexible capabilities enable us to simulate highly specific use-case conditions and deliver actionable insights for your R&D or qualification processes.

Specialized testing for additive manufacturing and fatigue behavior

Additive manufacturing components require tailored reliability assessments due to their unique material microstructures and build-related anisotropies. We offer:

• Standard and thermomechanical fatigue testing, including cycling under temperature and load
• Mechanical properties testing at mesoscale, ideal for AM parts
• In-situ monitoring with high-speed imaging and strain measurement

These capabilities are essential for validating AM components in mission-critical applications such as aerospace, medtech, and industrial robotics.

High-resolution characterization and failure analysis

To complement our reliability testing services, we provide advanced material characterization and defect analysis using state-of-the-art tools:

• High-resolution CT scanning for internal defect inspection
• Surface and phase analysis via SEM, EDX, FTIR, and XRD
• Mechanical property mapping down to the mesoscale

These insights are crucial for failure mode identification, lifetime prediction, and feedback into design improvements.

CSEM is a member of the ASTM International Consortium for Materials Data and Standardization (CMDS), contributing to the development of shared testing protocols and traceable datasets for advanced manufacturing technologies.

CSEM joined the ASTM International’s Additive Manufacturing Center of Excellence in 2023.

• Reliability of RF MEMS relays for space applications.
  Published in Microelectronics Reliability, this study demonstrated the effectiveness of CSEM’s sequential stress testing approach in qualifying miniaturized RF MEMS relays for the harsh mechanical, thermal, and vacuum conditions of space.
  👉 Reliability assessment of miniaturized electromechanical RF relays for space applications, Marozau I., Unterhofer S., Berry, M., Aubry, G., 2022, Microelectronics Reliability, DOI:10.1016/j.microrel.2022.114753
      
• Low-temperature, hermetically sealed transparent packages.
  Published in IEEE, ECTC Proceedings, CSEM developed and validated low-temperature, optically transparent, hermetic packaging technologies suitable for both implantable medical devices and space-grade components.
  👉 Low temperature hermetically sealed, optically transparent miniature packages: from medical to space, James, R., Durante, Revol, V., Marozau, I. , 2021, IEEE 71st Electronic Components and Technology Conference, DOI: 10.1109/ECTC32696.2021.00265
      
• Sequential bi-parameter MEMS testing for automotive-to-space transferability.
  Published in Microelectronics Reliability, this work introduced a sequential bi-parameter testing methodology to assess whether commercial automotive MEMS can meet the reliability demands of space environments.
  👉 Can Automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing, Auchlin, M., Marozau, I., Bayat, D., Marchand L., Gass, V., Serda, O., 2020, Microelectronics Reliability, DOI: 10.1016/j.microrel.2020.113913.
      
• Reliability evaluation of a MEMS scanner
  Published in SPIE OPTO MOEMS and Miniaturized Systems, this study provided a comprehensive reliability evaluation of a MEMS scanner, identifying dominant failure modes under mechanical and thermal stress to support its use in precision optical systems.
  👉 Reliability evaluation of a MEMS scanner, Lani, S., Marozau, Y., Dadras, M., 2017, SPIE OPTO MOEMS and Miniaturized Systems, DOI: 10.1117/12.2252191