19. September 2022

Launch of the Horizon Europe RIA project PATTERN

Dieser Artikel ist nur auf Englisch verfügbbar.

PATTERN will bring long-awaited breakthroughs in the field of Photonic Integrated Circuits (PICs) and provide unrivalled new functionalities for a vast range of applications. The project will devise the world’s first Process Design Kit (PDK) and Assembly Design Kit (ADK) for microwave photonics at ultra‐high frequencies above 100 GHz, new methods for heterogenous integration of III-v gain materials (e.g. InP) as well as BiCMOS drivers with electro-optic and nonlinear platform of a thin-film lithium-niobate-on-insulator (LNOI). It also develop new functionalities in PICs such as acousto-optic modulation (AOMs) and optical isolation capabilities. PATTERN’s impact will be showcased through several demonstrators, from quantum to satellite free-space communications to ultrastable optical-based RF-sources. The results of PATTERN will be accessable to the photoncis community in the form of an open access foundry.

Photonic integrated circuits on a wafer
Engineer in a lab

PATTERN's approach aims to address many challenges in microwave photonics and PICs at the same time and attempts to integrate all major photonic functionalities on a single hybrid PIC: light generation, transmission, manipulation and detection, as well as electronic co-integration. PATTERN will pave the way for a new generation of advanced PICs with unrivalled novel functionalities, which will serve a wide range of applications from telecom and 5G/6G to quantum, LiDAR, optical computing and sensing technologies.