In Microrobotics & Packaging, the aim is to develop the following technological platforms to address current and future industrial needs in microassembly, lab automation, sensor integration, and packaging of optoelectronic, microfluidic and microelectronic devices:

• Development of fast and precise sensor-guided robots for microsystem assembly
• Handling of fluids and cells in fluids by combining microfluidics & robotics
• Development of sensors and integration of sensors for process control and quality monitoring
• Packaging and interconnect technologies for integration of complex microsystems

Although these four platforms are developing specific technologies in their respective domains, they interact strongly when it comes to the development of devices and systems. For example, sensor-guided robotics strongly depends on actuators with integrated sensors, which are cleverly packaged into a single unit. As another example, solutions for laboratory automation combine robotics with fluid handling modules which can be additionally equipped with integrated fluid-flow sensing technologies for on-line monitoring.