Microrobotics & Packaging
In Microrobotics & Packaging, the aim is to develop the following technological platforms to address current and future industrial needs in microassembly, lab automation, sensor integration, and packaging of optoelectronic, microfluidic and microelectronic devices:
Although these four platforms are developing specific technologies in their respective domains, they interact strongly when it comes to the development of devices and systems. For example, sensor-guided robotics strongly depends on actuators with integrated sensors, which are cleverly packaged into a single unit. As another example, solutions for laboratory automation combine robotics with fluid handling modules which can be additionally equipped with integrated fluid-flow sensing technologies for on-line monitoring.